Improved adhesion and interface ohmic contact on n-type 4H-SiC substrate by using Ni/Ti/Ni

Author： Linchao Han   Huajun Shen   Kean Liu   Yiyu Wang   Yidan Tang   Yun Bai   Hengyu Xu   Yudong Wu   Xinyu Liu  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.35, Iss.7, 2014-07, pp. : 72003-72006

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