Related content

Simulations of diffusion barrier deposition on porous low-k films

By Yanovitskaya Z.S.   Zverev A.V.   Shamiryan D.   Maex K.  

Microelectronic Engineering, Vol. 70, Iss. 2, 2003-11 ,pp. : 363-367

Elsevier

Access to resources Recommend Favorite

Characterization of low-k porous silica films incorporated with alkylene groups

By Uchida Y.   Katoh T.   Oikawa M.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 2, 2002-04 ,pp. : 259-264

Elsevier

Access to resources Recommend Favorite

Structure and property characterization of low-k dielectric porous thin films

By Bauer Barry   Lin Eric   Lee Hae-Jeong   Wang Howard   Wu Wen-Li  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 304-308

Springer Publishing Company

Access to resources Recommend Favorite

Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films

By Lau S.   Tolentino Ellie   Lim Yuen   Tolentino Evangeline   Koo Ann  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 299-303

Springer Publishing Company

Access to resources Recommend Favorite

Single damascene integration of porous Zirkon(TM) version 1 low-k dielectric films

By Malhouitre S.   Jehoul C.   Van Aelst J.   Struyf H.   Brongersma S.   Carbonell L.   Vos I.   Beyer G.   Van Hove M.   Gronbeck D.   Gallagher M.   Calvert J.   Maex K.  

Microelectronic Engineering, Vol. 70, Iss. 2, 2003-11 ,pp. : 302-307

Elsevier

Access to resources Recommend Favorite