Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow

Author: Sharif A.   Chan Y.C.  

Publisher: Elsevier

ISSN: 0921-5107

Source: Materials Science and Engineering: B, Vol.106, Iss.2, 2004-01, pp. : 126-131

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content