Dissolution kinetics of BGA Sn-Pb and Sn-Ag solders with Cu substrates during reflow
Publisher: Elsevier
ISSN: 0921-5107
Source: Materials Science and Engineering: B, Vol.106, Iss.2, 2004-01, pp. : 126-131
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content
Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. :