A Microindentation Technique for Determining Strength of Solder Interface with Silver Metallization on Co-fired Multilayer Ceramic Substrate

Author： Shang Jian Ku   Huang Rong-Fong   Wilcox David L.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.30, Iss.3, 2001-03, pp. : 260-265

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