E-MRS Spring Meeting 2002. The 300mm Silicon Era: Material, Equipment, Technology

By Richter H.   Umeno M.   Wagner P.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 311-311

Elsevier

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Defect requirements for advanced 300mm DRAM substrates

By Kupfer C.   Roth H.   Dietrich H.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 381-386

Elsevier

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Towards the Wireless 2010 Vision: A Technology Roadmap

By Mihovska Albena   Platbrood Fanny   Karetsos George   Kyriazakos Sofoklis   Muijen Robert   Guarneri Renata   Pereira Jorge  

Wireless Personal Communications, Vol. 42, Iss. 3, 2007-08 ,pp. : 303-336

Springer Publishing Company

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Photoelastic stress evaluation and defect monitoring in 300-mm-wafer manufacturing

By Geiler H.D.   Wagner M.   Karge H.   Paulsen M.   Schmolke R.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 445-455

Elsevier

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Impact of filtering on nanotopography measurement of 300mm silicon wafers

By Riedel F.   Gerber H.-A.   Wagner P.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 465-472

Elsevier

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