Photoelastic stress evaluation and defect monitoring in 300-mm-wafer manufacturing

Author: Geiler H.D.   Wagner M.   Karge H.   Paulsen M.   Schmolke R.  

Publisher: Elsevier

ISSN: 1369-8001

Source: Materials Science in Semiconductor Processing, Vol.5, Iss.4, 2002-08, pp. : 445-455

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Abstract