Photoelastic stress evaluation and defect monitoring in 300-mm-wafer manufacturing

By Geiler H.D.   Wagner M.   Karge H.   Paulsen M.   Schmolke R.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 445-455

Elsevier

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A roadmap towards cost efficient 300mm equipment

By Pfitzner L.   Kucher P.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 321-331

Elsevier

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Impact of filtering on nanotopography measurement of 300mm silicon wafers

By Riedel F.   Gerber H.-A.   Wagner P.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 465-472

Elsevier

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Doubleside polishing-a technology mandatory for 300mm wafer manufacturing

By Wenski G.   Altmann T.   Winkler W.   Heier G.   Holker G.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 375-380

Elsevier

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Oxide precipitates in annealed nitrogen-doped 300mm CZ-SI

By Akhmetov V.D.   Richter H.   Lysytskiy O.   Wahlich R.   Muller T.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 391-396

Elsevier

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