Photoelastic stress evaluation and defect monitoring in 300-mm-wafer manufacturing

By Geiler H.D.   Wagner M.   Karge H.   Paulsen M.   Schmolke R.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 445-455

Elsevier

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New challenges for 300mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding

By Dragoi V.   Lindner P.   Tischler M.   Schaefer C.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 425-428

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E-MRS Spring Meeting 2002. The 300mm Silicon Era: Material, Equipment, Technology

By Richter H.   Umeno M.   Wagner P.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 311-311

Elsevier

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SOD wafer technology

By Gu C.Z.   Sun Y.   Jia J.K.   Jin Z.S.  

Microelectronic Engineering, Vol. 66, Iss. 1, 2003-04 ,pp. : 510-516

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A roadmap towards cost efficient 300mm equipment

By Pfitzner L.   Kucher P.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 321-331

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