Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly

Author： Firmstone M.G.   Bartholomew P.M.   Lowrie D.J.J.   Mannan S.H.   Hutt D.A.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.11, Iss.1, 1999-01, pp. : 8-12

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