Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps*

Author: S.Honma   K.Tateyama**   H.Yamada**   K.Doi   N.Hirano   T.Okada   H.Aoki   Y.Hiruta   Sudo*** T  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.14, Iss.3, 1997-03, pp. : 47-50

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Abstract