Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement

Author: Lee K-W   Bea J-C   Fukushima T   Tanaka T   Koyanagi M  

Publisher: IOP Publishing

ISSN: 0268-1242

Source: Semiconductor Science and Technology, Vol.26, Iss.2, 2011-02, pp. : 25007-25010

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