Realization of ultrafast and high-quality anodic bonding using a non-contact scanning electrode

Author： Wu Jim-Wei   Yang Chii-Rong   Huang Mao-Jung   Yang Cheng-Hao   Huang Che-Yi  

Publisher： IOP Publishing

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.23, Iss.7, 2013-07, pp. : 75008-75016

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