Thin-film encapsulation technology for above-IC MEMS wafer-level packaging

By Zhang Qing   Cicek Paul-Vahé   Nabki Frederic   El-Gamal Mourad  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 12, 2013-12 ,pp. : 125012-125021

IOP Publishing

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A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

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Journal of Micromechanics and Microengineering, Vol. 25, Iss. 12, 2015-12 ,pp. : 125030-125040

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Wafer-level Au–Au bonding in the 350–450 °C temperature range

By Tofteberg Hannah R   Schjølberg-Henriksen Kari   Fasting Eivind J   Moen Alexander S   Taklo Maaike M V   Poppe Erik U   Simensen Christian J  

Journal of Micromechanics and Microengineering, Vol. 24, Iss. 8, 2014-08 ,pp. : 84002-84009

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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

By Bleiker Simon J.   Visser Taklo Maaike M.   Lietaer Nicolas   Vogl Andreas   Bakke Thor   Niklaus Frank  

Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 192-192

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Low-temperature Au/a-Si wafer bonding

By Jing Errong   Xiong Bin   Wang Yuelin  

Journal of Micromechanics and Microengineering, Vol. 21, Iss. 1, 2011-01 ,pp. : 15013-15019

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