Development and evaluation of a two-level functional structure for the thin film encapsulation

Author: Lee Jae-Wung   Sharma Jaibir   Singh Navab   Kwong Dim-Lee  

Publisher: IOP Publishing

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.23, Iss.7, 2013-07, pp. : 75013-75019

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Abstract