Effects of electromigration on resistance changes in eutectic SnBi solder joints

Author： Sun Jia   Xu Guangchen   Guo Fu   Xia Zhidong   Lei Yongping   Shi Yaowu   Li Xiaoyan   Wang Xitao  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.46, Iss.10, 2011-05, pp. : 3544-3549

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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