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Effect of anisotropy of tin on thermomechanical behavior of solder joints

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Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

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Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

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Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

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