Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

By Shohji Ikuo   Yoshida Tomohiro   Takahashi Takehiko   Hioki Susumu  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 219-223

Springer Publishing Company

Access to resources Recommend Favorite

Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy

By  

Advanced Materials Research, Vol. 2015, Iss. 1095, 2015-04 ,pp. : 95-98

Trans Tech Publications

Access to resources Recommend Favorite

Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

By Xiao Zhengxiang   Xue Songbai   Hu Yuhua   Ye Huan   Gao Lili   Wang Hui  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 6, 2011-06 ,pp. : 659-665

Springer Publishing Company

Access to resources Recommend Favorite

Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

By Tian Yanhong  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 136-147

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder

By Huang M.  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 7, 2013-07 ,pp. : 2624-2629

Springer Publishing Company

Access to resources Recommend Favorite