The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders

Author: Wang X.   Xiu Y.   Dong M.   Liu Y.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.22, Iss.6, 2011-06, pp. : 592-595

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Abstract