Creep properties of Sn-Ag solder joints containing intermetallic particles

By Choi S.   Lee J.   Guo F.   Bieler T.   Subramanian K.   Lucas J.  

JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 22-26

Springer Publishing Company

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Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particles

By Tai Feng   Guo Fu   Liu Jianping   Xia Zhidong   Shi Yaowu   Lei Yongping   Li Xiaoyan  

Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. : 50-56

Emerald Group Publishing Ltd

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Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

By Deng X.   Sidhu R.S.   Johnson P.   Chawla N.  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 55-64

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Influence of copper addition on adhesive strength of Sn–3Ag–1·5Sb solder joints

By Lee H.-T.   Chen M.-H.   Jao H.-M.  

Science and Technology of Welding & Joining, Vol. 9, Iss. 6, 2004-12 ,pp. : 555-559

Maney Publishing

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A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu₆ Sn₅ and Cu substrate in solder joints

By Suh J.   Tu K.   Tamura N.  

JOM, Vol. 58, Iss. 6, 2006-06 ,pp. : 63-66

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