Modulation of Parylene-C to silicon adhesion using HMDS priming

Author: Ong Xiao Chuan   Fedder Gary K   Gilgunn Peter J  

Publisher: IOP Publishing

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.24, Iss.10, 2014-10, pp. : 105001-105010

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