Related content

High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging

By Lin C.-J.   Lin M.-T.   Wu S.-P.   Tseng F.-G.  

Microsystem Technologies, Vol. 10, Iss. 6-7, 2004-10 ,pp. : 517-521

Springer Publishing Company

Access to resources Recommend Favorite

Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size

By Yang Chung   Jung Ho   Park Jae   Kim Hee  

Microsystem Technologies, Vol. 20, Iss. 4-5, 2014-04 ,pp. : 889-897

Springer Publishing Company

Access to resources Recommend Favorite

Wafer-level plasma activated bonding: new technology for MEMS fabrication

By Dragoi Viorel   Mittendorfer Gerald   Thanner Christine   Lindner Paul  

Microsystem Technologies, Vol. 14, Iss. 4-5, 2008-04 ,pp. : 509-515

Springer Publishing Company

Access to resources Recommend Favorite

A dielectrophoretic chip packaged at wafer level

By Iliescu Ciprian   Tay Francis   Xu Guolin   Yu Li   Samper Victor  

Microsystem Technologies, Vol. 12, Iss. 10-11, 2006-09 ,pp. : 987-992

Springer Publishing Company

Access to resources Recommend Favorite

Vacuum measurement in wafer level encapsulations by interference microscopy

By Bosseboeuf A.   Grandchamp J.   Breluzeau C.   Lani S.   Palomo J.   Bouville D.  

Microsystem Technologies, Vol. 12, Iss. 10-11, 2006-09 ,pp. : 1063-1069

Springer Publishing Company

Access to resources Recommend Favorite