New electroforming technology pressure aid for LIGA process

Author: Tsai T.-H.   Yang H.   Chein R.  

Publisher: Springer Publishing Company

ISSN: 0946-7076

Source: Microsystem Technologies, Vol.10, Iss.5, 2004-08, pp. : 351-356

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next