High-resolution patterning of silver conductive lines by adhesion contrast planography

Author: Kusaka Yasuyuki   Koutake Masayoshi   Ushijima Hirobumi  

Publisher: IOP Publishing

E-ISSN: 1361-6439|25|9|95002-95010

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.25, Iss.9, 2015-09, pp. : 95002-95010

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