CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

Author： Chuang Wan-Chun   Hu Yuh-Chung   Chang Pei-Zen  

Publisher： MDPI

E-ISSN： 1424-8220|12|12|17094-17111

ISSN： 1424-8220

Source： Sensors, Vol.12, Iss.12, 2012-12, pp. : 17094-17111

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

By Brito Nuno   Ferreira Carlos   Alves Filipe   Cabral Jorge   Gaspar João   Monteiro João   Rocha Luís  

Sensors, Vol. 16, Iss. 9, 2016-09 ,pp. : 1553-1553

MDPI

Access to resources Recommend Favorite

A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

By Luo Zhenyu   Chen Deyong   Wang Junbo   Li Yinan   Chen Jian  

Sensors, Vol. 14, Iss. 12, 2014-12 ,pp. : 24244-24257

MDPI

Access to resources Recommend Favorite

Manufacture of Micromirror Arrays Using a CMOS-MEMS Technique

By Kao Pin-Hsu   Dai Ching-Liang   Hsu Cheng-Chih   Wu Chyan-Chyi  

Sensors, Vol. 9, Iss. 8, 2009-08 ,pp. : 6219-6231

MDPI

Access to resources Recommend Favorite

Fabrication and Characterization of CMOS-MEMS Thermoelectric Micro Generators

By Kao Pin-Hsu   Shih Po-Jen   Dai Ching-Liang   Liu Mao-Chen  

Sensors, Vol. 10, Iss. 2, 2010-02 ,pp. : 1315-1325

MDPI

Access to resources Recommend Favorite

Wafer-Level Vacuum Packaging of Smart Sensors

By Hilton Allan   Temple Dorota S.  

Sensors, Vol. 16, Iss. 11, 2016-10 ,pp. : 1819-1819

MDPI

Access to resources Recommend Favorite