A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

Author： Luo Zhenyu Chen Deyong Wang Junbo Li Yinan Chen Jian

Publisher： MDPI

E-ISSN： 1424-8220|14|12|24244-24257

ISSN： 1424-8220

Source： Sensors, Vol.14, Iss.12, 2014-12, pp. : 24244-24257

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Wafer-Level Vacuum Packaging of Smart Sensors

By Hilton Allan Temple Dorota S.

Sensors, Vol. 16, Iss. 11, 2016-10 ,pp. : 1819-1819

MDPI

Access to resources Recommend Favorite

Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

By Brito Nuno Ferreira Carlos Alves Filipe Cabral Jorge Gaspar João Monteiro João Rocha Luís

Sensors, Vol. 16, Iss. 9, 2016-09 ,pp. : 1553-1553

MDPI

Access to resources Recommend Favorite

CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

By Chuang Wan-Chun Hu Yuh-Chung Chang Pei-Zen

Sensors, Vol. 12, Iss. 12, 2012-12 ,pp. : 17094-17111

MDPI

Access to resources Recommend Favorite

Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

By Hamzah Azrul Azlan Yunas Jumril Majlis Burhanuddin Yeop Ahmad Ibrahim

Sensors, Vol. 8, Iss. 11, 2008-11 ,pp. : 7438-7452

MDPI

Access to resources Recommend Favorite

A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

By Merdassi Adel Yang Peng Chodavarapu Vamsy P.

Sensors, Vol. 15, Iss. 4, 2015-03 ,pp. : 7349-7359

MDPI

Access to resources Recommend Favorite