Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

Author： Gong Zhuhao   Zhang Yulong   Guo Xin   Liu Zewen  

Publisher： MDPI

E-ISSN： 2072-666x|9|3|93-93

ISSN： 2072-666x

Source： Micromachines, Vol.9, Iss.3, 2018-02, pp. : 93-93

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