

Author: Mehandru R. Luo B. Kang B.S. Kim J. Ren F. Pearton S.J. Pan C.-C. Chen G.-T. Chyi J.-I.
Publisher: Elsevier
ISSN: 0038-1101
Source: Solid-State Electronics, Vol.48, Iss.2, 2004-02, pp. : 351-353
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content







