Microstructural investigation of electrodeposited CuAg-thin films

Author: Strehle S.   Menzel S.   Wendrock H.   Acker J.   Wetzig K.  

Publisher: Elsevier

ISSN: 0167-9317

Source: Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 506-511

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