Author: Simon M.
Publisher: Springer Publishing Company
ISSN: 0946-7076
Source: Microsystem Technologies, Vol.14, Iss.9-11, 2008-10, pp. : 1727-1729
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Manufacturing of microstructures with high aspect ratio by micromachining
By Gietzelt T.
Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. :
SOI wafer mold with high-aspect-ratio microstructures for hot embossing process
Microsystem Technologies, Vol. 10, Iss. 6-7, 2004-10 ,pp. :
Investigations on possibilities of inline inspection of high aspect ratio microstructures
By Engelke Rainer Ahrens Gisela Arndt-Staufenbiehl Norbert Kopetz Stefan Wiesauer Karin Löchel Bernd Schröder Henning Kastner Johann Neyer Andreas Stifter David Grützner Gabi
Microsystem Technologies, Vol. 13, Iss. 3-4, 2007-02 ,pp. :