Thermal stability of AlSiCu/W/n + p diodes with and without TiN barrier layer

Author： Yeh W.-K.   Chen M.-C.   Wang P.-J.   Liu L.-M.   Lin M.-S.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.270, Iss.1, 1995-12, pp. : 526-530

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