Low-k silicon nitride film for copper interconnects process prepared by catalytic chemical vapor deposition method at low temperature

Author： Sato H. Izumi A. Masuda A. Matsumura H.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.395, Iss.1, 2001-09, pp. : 280-283

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