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Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si₃N₄/Cu Solder Joints

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Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

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Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

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Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

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