Author： Mudryi S.
Publisher： Springer Publishing Company
ISSN： 1068-820X
Source： Materials Science, Vol.46, Iss.4, 2011-01, pp. : 464-472
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Abstract
We investigate the atomic structure of tin-based solders by X-ray diffraction methods and the reverse Monte Carlo method. Total and partial structural factors and pair correlation functions are calculated. It is shown that Sn0.987Cu0.013 , Sn0.962Ag0.038 , and Sn0.949Ag0.038Cu0.013 liquid alloys are characterized by a microinhomogeneous structure with Cu(Ag)-Sn clusters distributed in the tin-based matrix.
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