Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

By Islam M.N.   Chan Y.C.   Sharif A.   Alam M.O.  

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2031-2037

Elsevier

Access to resources Recommend Favorite

Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects Under Current Stressing

By Sa Xianzhang   Zhou Wei   Wu Ping  

Journal of Electronic Materials, Vol. 43, Iss. 4, 2014-04 ,pp. : 1144-1149

Springer Publishing Company

Access to resources Recommend Favorite

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n , and Implications for EM Reliability Assessment

By Budiman A.S.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2483-2488

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

By Ma Limin  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 425-430

Springer Publishing Company

Access to resources Recommend Favorite

Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

By Kotadia H.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2720-2731

Springer Publishing Company

Access to resources Recommend Favorite