Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures

Author: Rajamand P.   Tilgner R.   Schmidt R.   Baumann J.   Klofac P.   Rothenfusser M.  

Publisher: Elsevier

ISSN: 0026-2714

Source: Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1815-1820

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