Author: Crepel O. Desplats R. Bouttement Y. Perdu P. Goupil C. Descamps P. Beaudoin F. Marina L.
Publisher: Elsevier
ISSN: 0026-2714
Source: Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1809-1814
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Ferroelectric thin films for integrated passive components
By Klee M. Mackens U. Kiewitt R. Greuel G. Metzmacher C.
Philips Journal of Research, Vol. 51, Iss. 3, 1998-01 ,pp. :
Integration of passive components: an introduction
Philips Journal of Research, Vol. 51, Iss. 3, 1998-01 ,pp. :
Fine-line Passive Components for Hybrid Microelectronics*
Microelectronics International, Vol. 13, Iss. 3, 1996-03 ,pp. :