Author: Eyink K. Capano M. Walck S. Haas T. Streetman B.
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.26, Iss.4, 1997-04, pp. : 391-396
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Tomich D. Eyink K. Grazulis L. Brown G. Szmulowicz F. Mahalingam K. Seaford M. Kuo C. Hwang W. Lin C.
Journal of Electronic Materials, Vol. 29, Iss. 7, 2000-07 ,pp. :
By Romero O.S. Aragon A.A. Rahimi N. Shima D. Addamane S. Rotter T.J. Mukherjee S. Dawson L.R. Lester L.F. Balakrishnan G.
Journal of Electronic Materials, Vol. 43, Iss. 4, 2014-04 ,pp. :
By Zhao Lijie Speck J. Rajavel R. Jensen J. Leonard D. Strand T. Hamilton W.
Journal of Electronic Materials, Vol. 29, Iss. 6, 2000-06 ,pp. :