In situ test structures for the thermal expansion coefficient and residual stress of polysilicon thin films

By Liu Hai-Yun   Li Wei-Hua   Zhou Zai-Fa   Huang Qing-An  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 7, 2013-07 ,pp. : 75019-75027

IOP Publishing

Access to resources Recommend Favorite

Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers

By Sasangka Wardhana A   Lai Donny   Thompson Carl V   Sasangka Wardhana A   Sasangka Wardhana A  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 3, 2015-03 ,pp. : 35023-35036

IOP Publishing

Access to resources Recommend Favorite

Determining the steady-state chloride migration coefficient of ITZ in mortar by using the accelerated chloride migration test

By Yang Chung-Chia   Liang Chih-Hsin  

Journal of the Chinese Institute of Engineers, Vol. 37, Iss. 7, 2014-10 ,pp. : 892-898

Taylor & Francis Ltd

Access to resources Recommend Favorite

Engineering stress in thin films for the field of bistable MEMS

By  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 12, 2015-12 ,pp. : 125025-125031

IOP Publishing

Access to resources Recommend Favorite

Switching Process in SBT Thin Films

By Li Chunhua   Guo Lei   Zhu Jinsong   Lu Xiaomei   Liu Zhiguo   Wang Yening  

Integrated Ferroelectrics, Vol. 48, Iss. 1, 2002-01 ,pp. : 181-189

Taylor & Francis Ltd

Access to resources Recommend Favorite