Integration of SiOC air gaps in copper interconnects

Author： Gosset L.G.   Arnal V.   Brun P.   Broekaart M.   Monget C.   Casanova N.   Rivoire M.   Oberlin J.-C.   Torres J.  

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 274-279

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