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Springer Publishing Company

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Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

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Effect of anisotropy of tin on thermomechanical behavior of solder joints

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