Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

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Springer Publishing Company

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Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

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The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

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Journal of Materials Science: Materials in Electronics, Vol. 25, Iss. 4, 2014-04 ,pp. : 1681-1686

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Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

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