The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

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Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By Anderson Iver  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 55-76

Springer Publishing Company

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Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

By Shen Jun   Tang Qin   Pu Yayun   Zhai Dajun   Cao Zhongming   Chen Jie  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 12, 2013-12 ,pp. : 4881-4887

Springer Publishing Company

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Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

By Liu Changqing   Huang Zhiheng   Conway Paul   Thomson Rachel  

Journal of Materials Science, Vol. 42, Iss. 11, 2007-06 ,pp. : 4076-4086

Springer Publishing Company

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

Springer Publishing Company

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