Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders

Author: Baated Alongheng   Kim Keun-Soo   Suganuma Katsuaki   Huang Sharon   Jurcik Benjamin   Nozawa Shigeyoshi   Ueshima Minoru  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.21, Iss.10, 2010-10, pp. : 1066-1075

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Abstract