Stress development during evaporation of Cu and Ag on silicon

Author： Pienkos T.   Proszynski A.   Chocyk D.   Gladyszewski L.   Gladyszewski G.  

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 442-446

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