High temperature reliability on automotive power modules verified by power cycling tests up to 150 o C

Author： Coquery G.   Lefranc G.   Licht T.   Lallemand R.   Seliger N.   Berg H.  

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1871-1876

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