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Microelectronic Engineering, Vol. 71, Iss. 1, 2004-01 ,pp. : 76-89

Elsevier

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Strategies for ultralow- dielectrics for integrated-circuit interconnects

By Cerofolini G.F.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 2, 2002-04 ,pp. : 265-270

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New approach for calculation of line parameters of IC interconnects

By Ymeri Hasan   Nauwelaers Bart   Maex Karen   Roest David De  

Microelectronics International, Vol. 18, Iss. 1, 2001-01 ,pp. : 29-31

Emerald Group Publishing Ltd

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Effect of line resistance and driver width on crosstalk in coupled VLSI interconnects

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Microelectronics International, Vol. 24, Iss. 3, 2007-07 ,pp. : 42-45

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Materials characterization of the effect of mechanical bending on area array package interconnects

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