Publisher: Elsevier
Founded in: 1962
Total resources: 4
E-ISSN: 1872-941X
ISSN: 0026-2714
Subject:
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Microelectronics Reliability
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An introduction to Cu electromigration
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.Materials characterization of the effect of mechanical bending on area array package interconnects
By Rooney D.T., Todd Castello N., Cibulsky M., Abbott D., Xie D. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.Load characterization during transportation
By Ramakrishnan A., Pecht M. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.Reliability characteristics of high-k dielectrics
By Kim Y.-H., Lee J.C. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.Long time reliability study of soldered flip chips on flexible substrates
By Pahl B., Kallmayer C., Aschenbrenner R., Reichl H. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.By Wu Y.P., Alam M.O., Chan Y.C., Wu B.Y. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.Reliability testing of flexible printed circuit-based RF MEMS capacitive switches
By Lee S., Ramadoss R., Buck M., Bright V.M., Gupta K.C., Lee Y.C. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.Design optimization of ESD protection and latchup prevention for a serial I/O IC
By Huang C.-Y., Chen W.-F., Chuan S.-Y., Chiu F.-C., Tseng J.-C., Lin I.-C., Chao C.-J., Leu L.-Y., Ker M.-D. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.By Tao Y., Malshe A.P., Brown W.D. in (2004)
Microelectronics Reliability , Vol. 44, Iss. 2, 2004-02 , pp.