Inverse analysis of material removal data using a multiscale CMP model

Author： Seok J.   Kim A.T.   Sukam C.P.   Jindal A.   Tichy J.A.   Gutmann R.J.   Cole T.S.  

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 478-488

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