Direct bonding of Si wafer pairs with SiO 2 and Si 3 N 4 films with a fast linear annealing

Author: Lee S.H.   Song O.   Yoon C.S.   Kim C.K.  

Publisher: Elsevier

ISSN: 1369-8001

Source: Materials Science in Semiconductor Processing, Vol.5, Iss.6, 2002-12, pp. : 519-524

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