A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology

Author： Song Y.-H. Kim S.G. Lee S.B. Rhee K.J. Kim T.S.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.9, 2003-09, pp. : 1405-1410

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